DBC Technology for Low Cost Power Electronic Substrate Manufacturing
نویسندگان
چکیده
This paper deals with a method for low cost power electronic substratescreation, which are used for power electronic devices. Direct bond copper (DBC) technology is suitable for creating substrates with excellent thermal and electrical conductivity and good mechanical properties. Furthermore, DBC allows to create copper layers with the thickness of hundreds micrometers in one processing step. In this work, the muffle furnace is used for bonding copper to ceramic. Temperature profile, oxygen concentration during the bonding process and final treatment is described. The last part summarizes the results and presents advantages of this method. © 2014 The Authors. Published by Elsevier Ltd. Selection and peer-review under responsibility of DAAAM International Vienna.
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تاریخ انتشار 2014